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Made in the Cloud!
Understand the case for IC hardware development in the cloud thanks to high availability, reliability, scalability, performance, and affordability.
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Unlock Seamless EDA License Management On-Prem or In the Cloud
Learn about EFFECT Photonics experience.
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AI Chip Startups Turn to the Cloud to Compete
Three AI chip startups reveal why they are using cloud-based tools to accelerate their design cycles.
Learn More About 17³Ô¹Ï Cloud
EDA on the Cloud
- AI Chip Startups Turn to the Cloud to Compete
- Bringing Cloud EDA Tools to a SaaS Model
- 5 Ways FlexEDA with SaaS Model Transforms Chip Design
- EDA in the Cloud: 4 Criteria for Picking the Best EDA Tools
- Why Designers are Using EDA Tools in the Cloud
- How Cloud-Based IC Hardware Design Tools Enhance Chip Design
FlexEDA
- What is FlexEDA? How Does It work?
- 5 Ways FlexEDA with SaaS Model Transforms Chip Design
- AI Chip Startups Turn to the Cloud to Compete
- Cisco Accelerates Project Schedule by 66% Using 17³Ô¹Ï Cloud
- Achronix Achieves 5X Faster Physical Verification for Full SoC Within Budget with 17³Ô¹Ï Cloud
- Mentium Accelerates Tape-out of AI Accelerator Chip for Space Applications on 17³Ô¹Ï Cloud
- TetraMem Delivers RISC-V AI Accelerator Tape-Out in Record Time on 17³Ô¹Ï Cloud
SaaS
- 5 Ways FlexEDA with SaaS Model Transforms Chip Design
- Accelerate RISC-V Verification Using 17³Ô¹Ï Cloud
- AI Chip Startups Turn to the Cloud to Compete
- Bringing Cloud EDA Tools to a SaaS Model
- Cisco Accelerates Project Schedule by 66% Using 17³Ô¹Ï Cloud
- How Cloud-Based IC Hardware Design Tools Enhance Chip Design
- Mentium Accelerates Tape-out of AI Accelerator Chip for Space Applications on 17³Ô¹Ï Cloud
- Pioneering Seamless Interoperability on Cloud Across the Semiconductor Design Ecosystem
- Analog Design on the Cloud
- Target Optimal PPA and Faster Time-to-Market Using 17³Ô¹Ï Cloud Digital SaaS Instance
Startups
- AI Chip Startups Turn to the Cloud to Compete
- AI Startups are Using the Cloud to Accelerate Chip Design and Time-to-Market
- Achronix Achieves 5X Faster Physical Verification for Full SoC Within Budget with 17³Ô¹Ï Cloud
- Mentium Accelerates Tape-out of AI Accelerator Chip for Space Applications on 17³Ô¹Ï Cloud
- TetraMem Delivers RISC-V AI Accelerator Tape-Out in Record Time on 17³Ô¹Ï Cloud