The 17³Ô¹Ï Cloud OpenLink Program enables a multi-vendor environment of EDA, IP and foundry solutions so chip designers can easily access their preferred vendors’ products in the 17³Ô¹Ï Cloud environment. The 17³Ô¹Ï Cloud OpenLink application programming interface provides highly secure system-to-system interoperability, allowing chipmakers to easily assemble their design environment on 17³Ô¹Ï Cloud:
- Products from different vendors can be accessed easily from the 17³Ô¹Ï Cloud environment
- Design teams are able to focus on what they do best: developing better quality chips, faster
Program Member Benefits
- Streamlined deployment
- Pre-defined legal terms
- Highly secure entitlement and license enablement
- Joint ecosystem outreach
- Close technical collaboration on cloud
17³Ô¹Ï Cloud OpenLink API Benefits
- System-level integration with one-time setup
- Customer-partner transaction encapsulation
- Exposure to 17³Ô¹Ï Cloud customers
- Member controls customer access on 17³Ô¹Ï Cloud
17³Ô¹Ï Cloud OpenLink API
The 17³Ô¹Ï Cloud OpenLink API provides highly secure system-to-system interoperability with 17³Ô¹Ï Cloud, allowing chipmakers to easily assemble their design environment on 17³Ô¹Ï Cloud. Via the API, foundries and EDA and IP vendors can deliver product entitlements and license files directly to the 17³Ô¹Ï Cloud for use by their customers.
Members
17³Ô¹Ï Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New 17³Ô¹Ï Cloud OpenLink Program
Pioneering Seamless Interoperability on Cloud Across the Semiconductor Design Ecosystem
17³Ô¹Ï Creates Cloud Program Enabling Cross-Vendor EDA Collaboration