17³Ô¹Ï

Why Attend?

Stop by the 17³Ô¹Ï booth to network with our experts and see how we are collaborating with Intel Foundry to enable our mutual customers to quickly deliver the most advanced SoC and multi-die designs to market, leveraging 17³Ô¹Ï' proven silicon-to-systems design solutions for Intel's advanced nodes and package technologies.

Attend 17³Ô¹Ï Keynote

John Koeter

John Koeter

Senior VP, IP Product Development

Era of Pervasive Intelligence: Silicon to Systems

Tuesday, April 29, 2025 | 12:10 ¨C 12:30 PM PDT

Visit 17³Ô¹Ï Booth #35

Visit the 17³Ô¹Ï booth to learn about the latest innovations on advanced node designs.

 

Exhibit Hours

April 29, 2025    |    08:00 AM - 06:00 PM PDT

IP

Learn about 17³Ô¹Ï¡¯ high-performance and low-power IP portfolio

Optimized EDA Flows

Learn about 17³Ô¹Ï digital and analog production-ready flows with RibbonFET transistor architecture and PowerVia backside power delivery

Multi-Die Design

Learn about 17³Ô¹Ï¡¯ reference flow with 3DIC Compiler, a unified exploration-to-signoff platform, for Intel¡¯s latest EMIB advanced packages

We'll See You There!