Cloud native EDA tools & pre-optimized hardware platforms
Stop by the 17³Ô¹Ï booth to network with our experts and see how we are collaborating with Intel Foundry to enable our mutual customers to quickly deliver the most advanced SoC and multi-die designs to market, leveraging 17³Ô¹Ï' proven silicon-to-systems design solutions for Intel's advanced nodes and package technologies.
Visit the 17³Ô¹Ï booth to learn about the latest innovations on advanced node designs.
Exhibit Hours
April 29, 2025 | 08:00 AM - 06:00 PM PDT
Learn about 17³Ô¹Ï¡¯ high-performance and low-power IP portfolio
Learn about 17³Ô¹Ï digital and analog production-ready flows with RibbonFET transistor architecture and PowerVia backside power delivery
Learn about 17³Ô¹Ï¡¯ reference flow with 3DIC Compiler, a unified exploration-to-signoff platform, for Intel¡¯s latest EMIB advanced packages