17³Ô¹Ï

This newsletter provides the latest information on 17³Ô¹Ï Photonic 17³Ô¹Ï including product announcements, new papers, tech talks, upcoming events, and more.

In this issue:

 

Software Updates

17³Ô¹Ï OptoCompiler and 17³Ô¹Ï OptSim 2023.03-SP1-1

17³Ô¹Ï OptoCompiler and 17³Ô¹Ï OptSim 2023.03-SP1-1

  • Simplified process  to include models and model templates installed outside of the main installation, enabling inclusion of custom models and model template  updates released separately from official tool releases
  • Updates for co-simulation with PrimeSim
  • Miscellaneous bug fixes and improvements
MetaOptic Designer generates metalens layouts | 17³Ô¹Ï

RSoft Photonic Device Tools 2023.03-SP1-1

  • Several updates to MetaOptic Designer, including significantly improved speed and multithreading performance for most simulations
  • Miscellaneous bug fixes and improvements

Latest Blog Articles

Designing PAM4 Transceiver PICs and Measuring TDECQ in 17³Ô¹Ï OptoCompiler E-O Co-Design Platform

Designing PAM4 Transceiver PICs and Measuring TDECQ in 17³Ô¹Ï OptoCompiler E-O Co-Design Platform

Can Photonics Power Next-Gen AI Chatbots?

Can Photonics Power Next-Gen AI Chatbots?

Foundry Spotlight: Sivers Photonics

Sivers Photonics
Sivers Photonics
Sivers Photonics

Sivers Photonics is the world¡¯s most advanced supplier of customized III-V semiconductor photonics devices, enabling next-generation applications in fast-growth optical communications, sensing, and quantum markets. Sivers is a key strategic supplier to many Fortune 100 and Silicon Valley customers.

With over 20 years of expertise, the foundry provides end-to-end design, manufacturing and qualification for early-phase prototypes and high-volume production. Sivers supports up to 100mm wafer sizes on InP, GaAs, GaSb, and GaN substrates for a broad range of photonic devices including FP & DFB Lasers, SOAs, RSOAs and Detectors. 

Sivers¡¯ advanced 100mm indium phosphide custom product platform (InP100), a design and manufacturing framework for InP photonics devices, uses established and reliable process modules to produce a broad range of device types. InP100 has a fully customisable mechanical interface for hybrid integration on Silicon Photonics.

Sivers and 17³Ô¹Ï are collaborating to embed Sivers¡¯ laser and gain chip models into the 17³Ô¹Ï OptoCompiler design automation platform by adding simulation models for OptSim. This collaboration will enable end users to reduce design cycle times and improve hybrid PIC performance. 

Resources

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New articles:

Industry Articles

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  • , phys.org
  • , Laser Focus World
  • , EE News
  • , Laser Focus World
  • , optics.org
  • , EurekAlert!
  • , TechWire Asia

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17³Ô¹Ï at the META Conference
Maryvonne teaches the workshop on MetaOptic Designer at the META Conference
Chenglin Xu at the 17³Ô¹Ï booth at the META Conference

Staff engineer, Chenglin Xu, at the recent META Conference 2023 in Paris, France on July 18

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