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17³Ô¹Ï IP Technical Bulletin Archives
17³Ô¹Ï IP Technical Bulletin - Q1 25
- ARC Zone: The Rise of Generative AI on the Edge
- 17³Ô¹Ï Leads the Way with First Certified TRNG for Automotive
- How Ultra Ethernet and UALink Enable High-Performance, Scalable AI Networks
- IP for 3D Multi-Die Designs
- How 224G SerDes IP is Enabling the Transition to Linear Drive Optics
- Achieving Reliable and Secure SoC Designs with Advanced OTP IP
17³Ô¹Ï IP Technical Bulletin - Q4 24
- ARC Zone: Enhancing RISC-V RVV with Custom DSP Instructions for Embedded Applications
- 17³Ô¹Ï: Pioneering PCIe IP 17³Ô¹Ï with Enhanced Security for the Automotive Market
- Scaling Bandwidth for AI/HPC Multi-Die Designs with Ethernet, PCIe & UCIe IP
- 40G UCIe IP Advantages for AI Applications
- 17³Ô¹Ï Foundation IP Enabling Low-Power AI Processors
17³Ô¹Ï IP Technical Bulletin - Q3 24
- ARC Zone: Synaptics Migration to ARC HS Processor with 17³Ô¹Ï QIK and DSO.ai ¡°Warm Start¡±
- How PCIe 7.0 Addresses AI¡¯s Bandwidth Demands
- Innovating ADAS and IVI SoCs for SDVs with Advanced Automotive IP
- SRAM PUF: The Secure Silicon Fingerprint
- Reimagining PVT Monitoring IP for Advanced Node GAA Process
17³Ô¹Ï IP Technical Bulletin - Q2 24
17³Ô¹Ï IP Technical Bulletin - Q1 24
- ARC Zone: How the RISC-V ISA Offers Greater Design Freedom and Flexibility
- Navigating PCIe 6.0 Power and Latency Challenges in HPC SoCs
- How Direct-Drive Electro-Optical Interfaces are Changing the Game for 800G and Beyond
- Maximizing Performance & Reliability for Flash Applications with 17³Ô¹Ï xSPI Solution
- 17³Ô¹Ï and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip
17³Ô¹Ï IP Technical Bulletin - Q4 23
- ARC Zone: Integrating Functional Safety and Quality to Deliver High-Quality Automotive IP
- The Controller Designers Need for 1.6 Terabits per second Ethernet Interfaces
- PCI Express 6.0 for Automotive Applications
- Optimizing PPA for HPC & AI Applications with 17³Ô¹Ï Foundation IP
- How LPDDR5X Delivers the Speed Your Designs Need
17³Ô¹Ï IP Technical Bulletin - Q3 23
- ARC Zone: Virtualization Emerges as a Requirement for Embedded AI in Automotive SoCs
- Arriving at 224GbE: Double the Speed, Catapulting Complexity!
- CXL: How an Accelerator Link Caused a Memory Revolution
- Future Microcontrollers Need eMRAM
- CXL Applications and Opportunities
- How Technology and Workloads are Driving Multi-Die Systems
17³Ô¹Ï IP Technical Bulletin - Q2 23
- ARC zone: AI Can See Clearly Now the Noise Has Gone - An Emerging Use-Case for 17³Ô¹Ï IP in Real-Time Video Enhancement
- Revving up Automotive Embedded Storage with UFS
- The Promise of ISO/SAE 21434 for Automotive Cybersecurity
- Ensuring Multi-Die System Reliability with UCIe IP
- Living on the Computing Edge for 100G Ethernet IP
17³Ô¹Ï IP Technical Bulletin - Q1 23
- ARC zone: Combining Neural Network Processors and DSPs to Achieve the Best AI Performance
- Benefits of a Silicon-Proven 800G Ethernet Implementation
- Ethernet Security Relies on Efficient Media Access Control Security (MACsec)
- TEE Device Interface Secure Protocol (TDISP) for PCIe and CXL
- PAM-3 Technology and Implementation for USB4 v2
17³Ô¹Ï IP Technical Bulletin - Q4 22
17³Ô¹Ï IP Technical Bulletin - Q3 22
- ARC Zone: The Rise of Transformers: Greater Accuracy in Real-Time Vision Processing
- Achieving Systematic ASIL D ISO 26262 Compliance for Automotive SoCs
- Multi-Die SoCs Gaining Strength with Introduction of UCIe
- Protecting Data over PCIe & CXL in Cloud Computing
- Designing for Effective Use of PCIe 6.0 Bandwidth
17³Ô¹Ï IP Technical Bulletin - Q2 22
- ARC Zone: New Neural Processing for Embedded Apps
- ARC Zone: Floating Point with ARC VPX Vector DSPs
- Can Chips Keep Up with AI Algorithms at the Edge?
- What Designers Need to Know About HBM3
- 112G Ethernet PHY Design Challenges and the Path Forward
- Memory Security Relies on Ultra High-Performance AES-XTS Encryption/Decryption
17³Ô¹Ï IP Technical Bulletin - Q1 22
- ARC Zone: Meet Both Security and Safety Needs in New Automotive SoCs with ARC SEM130FS Processor
- PCIe PHY IP Enabling U.2/U.3 Form Factors for Hyperscale Data Centers
- An Insight into the World of 224Gbps Electrical Interface
- Why Large, High-Res Displays Need HDCP 2.3
- Selecting NVM IP for PMICs: 4 Key Considerations
DesignWare Technical Bulletin - Q4 21
- Insight into the OpenHBI Die-to-Die Standard
- Meeting Processor Performance and Safety Requirements for New ADAS & Autonomous Vehicle Systems
- ARC Zone: Implementing High Performance Sensor Fusion on an Embedded Budget, Using ARC VPX DSP IP
- Integrated MAC, PCS and PHY IP for 400G/800G Ethernet
- eMRAM for Low-Power SoCs in Advanced Process Nodes
- Under the Hood of ASIP Designer - Application-Specific Processor Design Made Possible by Tool Automation
DesignWare Technical Bulletin - Q3 21
- Automotive Cybersecurity Starts with Chips & IP
- Complete Die-to-Die IP Solution: Use Cases and Requirements
- ARC Zone: Optimize Data Center Power & Performance Using Computational Storage with Processor IP
- Anatomy of an Integrated Ethernet PHY IP for High Performance Computing SoCs
- CMOS Image Sensor Pixel Correction with OTP NVM IP
DesignWare Technical Bulletin - Q2 21
- Successful PCI Express 6.0 Designs at 64GT/s with IP
- Tightly-Coupled Analog and DSP Architecture for Best 112G SerDes IP Performance
- ARC Zone: Hardware Overlay Management for Data Intensive, Ultra-Low Power Edge Devices
- Implementing Power Efficient Facial Detection and Recognition with ARC Processors
- Protecting Data over PCIe & CXL in Cloud Computing
- Managing Your Silicon Lifecycle with In-Chip Sensor and PVT Monitor IP
DesignWare Technical Bulletin - Q1 21
- Using IP Interfaces to Reduce HPC Latency and Accelerate the Cloud
- Why In-Memory Computing Will Disrupt Your AI SoC Development
- ARC Zone: How to Future Proof Your DSP Processor Decision for Evolving SoC Designs
- Bringing Machine Learning from the Cloud to the Embedded Edge
- Integrated IP for MIPI Camera & Display
- Hardware Aware Training for Power-Efficient Keyword Spotting on General Purpose and Specialized Hardware
DesignWare Technical Bulletin - Q4 20
- From XSR to Long-Reach: Avoid Cloud Data Traffic Jams with High-Speed Interface IP
- Emerging Applications for CXL
- ARC Zone: Enhance Image! Real-time Super Resolution with ARC EV Processor IP
- Meeting Automotive Functional Safety Requirements with GPIOs
- Error Correction Code (ECC) in DDR Memories
- Softening Hardware: Using Application-Specific Processors to Optimize Modern SoC Designs
DesignWare Technical Bulletin - Q3 20
- Advantages of Firmware-Based Training in High-Speed DDR IP
- Accurate Modeling and Integration Considerations for 112G SerDes PHY IP
- ARC Zone: Meeting Increasing Performance Requirements in Embedded Applications with Scalable Multicore Processors
- Production Test of System-in-Package with Die-to-Die PHY IP
- Upgrade Your SoC Design to USB4
- Selecting Memory Architectures for AI SoCs
DesignWare Technical Bulletin - Q2 20
- Estimating Power Early & Accurately for Smart Vision SoCs
- Parallel-Based PHY IP for Die-to-Die Connectivity
- ARC Zone: Addressing IoT Connectivity Challenges with a Low-power IoT Communications Solution
- A Few Key Features to Note About DDR5
- An Introduction to TCAMs
- Using Artificial Intelligence to Harness the Coming Data Explosion
DesignWare Technical Bulletin ¨C Q1 20
- How AI in Edge Computing Drives 5G and the IoT
- Choosing the Right IP for Die-to-Die Connectivity
- ARC Zone: Faster, More Accurate Data Computation with a New Generation of DSPs
- Key Features Designers Should Know About LPDDR5
- Maximizing Application Performance on ARC DSP Processors with the MATLAB/Simulink Plugin
- Techniques for Ensuring Security in Processor-based SoCs
DesignWare Technical Bulletin - Q3 19
- Training Real-World Self-Driving Cars with Video Games
- Introduction to the Compute Express Link Standard
- ARC Zone: Designing AI and Security into High-Performance SSDs
- Using Compliant VESA DSC IP to Enable 8K+ Displays
- Shift from NRZ to PAM-4 Signaling for 400G Ethernet
- True Random Number Generators to Secure Any SoC
DesignWare Technical Bulletin ¨C Q2 19
- Application-Specific Processors for High Throughput, Low Latency, and Flexible 5G Communication SoCs
- The Adoption of 5G for Automotive Applications
- Addressing the Changing DSP and Controller Needs of 5G New Radio Modems
- Unleash the Mobile IoT with Secure Connectivity Powered by Integrated SIM
- Using Nature + Nurture to Develop Artificial Intelligence SoCs
DesignWare Technical Bulletin ¨C Q1 19
DesignWare Technical Bulletin ¨C Q4 18
- Hyperscale Data Centers Driving Next-Generation 400G Ethernet Interconnects
- Meeting Complex Design Requirements for Integrated ADAS Domain Controller SoCs
- ARC Zone: High-Performance DSP and Control Processing for Complex 5G Requirements
- Scalability, Security and Reliability with One-Time Programmable Non-Volatile Memory
- Minimizing Security Vulnerabilities in Connected Cars Starts with Silicon
- High-Performance 17³Ô¹Ï for Next-Generation SSD Designs
DesignWare Technical Bulletin ¨C Q3 18
DesignWare Technical Bulletin ¨C Q2 18
DesignWare Technical Bulletin ¨C Q1 18
- Implementing High-Performance Deep Learning without Breaking Your Power Budget
- HDMI 2.1 for a More Immersive Viewing Experience
- ARC Zone: Embedding Artificial Intelligence into Our Lives
- 17³Ô¹Ï and Arm Display IP Solution for 4K Smartphone and AR/VR Devices
- Challenges of Moving to 32GT/s PCI Express Designs
DesignWare Technical Bulletin ¨C Q4 17
- Understanding Hardware Roots of Trust
- Securing High-Value Targets with a Secure IP Subsystem
- ARC Zone: Easing Smart Automotive Design and Certification with High-Performance Processors for Safety-Critical Applications
- Using Threat Models and Risk Assessments to Define Device Security Requirements
- eMMC and UFS Inline Encryption in Android-based Mobile Applications
DesignWare Technical Bulletin ¨C Q1 17
- New USB Audio Class for USB Type-C Digital Headsets
- Facial Expression Analysis with Deep Learning & Computer Vision
- ARC Zone: Advanced Processors Enable Seamless Human-Machine Interfaces for Virtual Reality
- Understanding the Ethernet Nomenclature - Data Rates, Interconnect Mediums and Physical Layer
- Using Foundation IP for Low Power in IoT SoCs
DesignWare Technical Bulletin ¨C Q4 16
- PCI Express 4.0 Lane Margining and its Advantages
- Understanding Automotive DDR DRAM
- Getting Optimal PPA for 16FFC SoCs
- Implementing MIPI Camera and Display Interfaces in Applications Beyond Mobile
- Challenges of USB 3.1 Host Certification
- ARC Zone: Protecting Against Side-Channel Attacks with an Ultra-Low Power Processor
DesignWare Technical Bulletin ¨C Q3 16
- PCI Express in Automotive Applications ¨C Design for Reliability
- Enabling Cars to See with Efficient Vision Processors
- Best Practices for ISO 26262 ASIL Ready Automotive ADAS SoCs
- Accelerate Your Design Schedule with Automotive-Qualified Reprogrammable Non-Volatile Memory IP
- Reach Your ASIL Targets with Certified Ethernet IP
- ARC Zone: Choosing an Embedded Processor for Safety-Critical Automotive Applications
DesignWare Technical Bulletin ¨C Q2 16
- Challenges of USB 3.1 IP Certification
- Implementing Large Numbers of Virtual Functions with PCI Express SR-IOV
- Accelerating Cryptographic Operations in the TLS Protocol
- Wired 2.5G/5G Ethernet Speeds for Faster Wireless Connectivity
- ARC Zone: Accelerating IoT Applications with a Data Fusion IP Subsystem
DesignWare Technical Bulletin ¨C Q1 16
DesignWare Technical Bulletin ¨C Q4 15
- Power Gating: Reducing PCI Express Power Consumption to Mobile Levels
- Developing Software for Proprietary Cameras for Integration with CSI-2 Host IP Prototyping Kits
- Understanding Advanced Interconnect IP Peripherals for IoT and Automotive SoCs
- Configuring DDR Subsystems for Your Design
- ARC Zone: Processor Configurations for Low-Power IoT Applications
DesignWare Technical Bulletin ¨C Q3 15
DesignWare Technical Bulletin ¨C Q2 15
- Embedding Vision in Next-Generation SoCs
- DesignWare Hybrid IP Prototyping Kits for Prototyping, Software Development & Integration in 64-Bit ARM Processor-Based Designs
- Multicore Design Using ASIPs: Blending Performance and Efficiency with Programmability
- Understanding Your Power Profile from RTL to Gate-level Implementation
- 25G Ethernet in the Connected World
DesignWare Technical Bulletin ¨C Q1 15
- RAS Data Protection Consideration for PCI Express? Designs
- IP Subsystems: The Next Frontier for IP Integration
- Faster Iteration Flows to Accelerate Hardware/Software Development
- Converting Existing USB Designs to Support USB Type-C Connections
- Advantages of Embedded MTP Non-Volatile Memory for IoT SoC Designs
- Is the FinFET Process the Right Choice for Your Next SoC?
- ARC Zone: Configurable & Extensible 32-bit RISC Processors for Next Generation SSDs
DesignWare Technical Bulletin ¨C Q4 14
- USB 3.1: Physical, Link, and Protocol Layer Changes
- HDMI and MHL IP for Mobile and Digital Home Connectivity
- Verifying ARM AMBA ? 5 CHI Interconnect-Based SoCs Using Next-Generation VIP
- LPDDR4 for a Better Power/Performance Balance
- ARC Insider: Designing Processors for High-Performance Embedded Linux Applications
DesignWare Technical Bulletin ¨C Q3 14
- ARC Insider: Low-Power Processor 17³Ô¹Ï for Always-On Devices
- IP Accelerated: IP Integration with Less Effort, Lower Risk, and Faster Time-to-Market
- Design Considerations for Non-Volatile Memory IP in Automotive Applications
- Designing for Success: USB IP for FinFET Processes
- PCI Express Controller Design Challenges at 16 GT/s
- What's New in Verification IP?
DesignWare Technical Bulletin ¨C Q2-14
DesignWare Technical Bulletin ¨C Q1-14
- Optimizing High-End Embedded Designs with the ARC HS Processor Family
- Demystifying 40 Gigabit Ethernet Interfaces in Data Centers
- What's New with DesignWare Building Blocks and minPower Components in I-2013.12?
- Delivering on the Promise of Guaranteed Isochronous Traffic in USB 3.1
- ARC Insider: Automotive Safety: Achieving ISO 26262 Compliance with Processor IP Part 2
DesignWare Technical Bulletin ¨C Q4-13
- Adapting Non-Volatile Memory to Evolving Markets
- Quality of Service in DesignWare AMBA AXI Interconnect
- Achieving 10 Gbps Data Rates in USB 3.1 Using Multiple INs and Hub Playload Buffering
- ARC Insider: Automotive Safety: Achieving ISO 26262 Compliance with Processor IP
- Tips and Tricks: Guidelines for Successful IP Integration and Tapeout
DesignWare Technical Bulletin ¨C Q3-13
- Simplifying Sensor Integration with the DesignWare Sensor IP Subsystem
- Optimizing CPUs, GPUs and DSPs for High Performance and Low Power at 28nm
- Bandwidth Considerations for PCI Express 3.0 Designs
- Modern FPGA-Based Prototyping Systems Accelerate the Transition from Stand-Alone IP Block Validation to Integrated Systems
- MHL vs. Miracast
- Tips and Tricks: Using Buildroot to Build an Embedded Linux System for DesignWare ARC? Processors
DesignWare Technical Bulletin ¨C Q1¨C13
- FinFET Design, Manufacturability, and Reliability
- Embedded Memory Test & Repair at 20-nm Nodes and Below
- Efficient Audio Processing with DesignWare ARC? Audio Processors
- Ethernet QoS v4.0 Controller for 802.1 Compliant Networks
- Virtualizer Development Kits: Fast Track to DesignWare Software Prototyping
- Transitioning from USB 2.0 HSIC to USB 3.0 SSIC
DesignWare Technical Bulletin ¨C Q3-12
- Selecting Standard Cell and Memory IP to Meet Chip Goals
- Managing Design Complexity with a Complete Audio IP Subsystem
- Building an IP-XACT Design and Verification Environment with DesignWare IP and core Tools
- A Simple Way to Use DesignWare Libraries in FPGA-Based Design Prototypes
- 17³Ô¹Ï Verification IP, What's New?