17³Ô¹Ï Cloud
Cloud native EDA tools & pre-optimized hardware platforms
Request a Free Trial
How to Approach Security for Multi-Die Designs
Date: Apr 24, 2025
Featured Speaker:
- Dana Neustadter, Senior Director of Product Management, 17³Ô¹Ï
Why You Should Attend:
Security is a big concern for electronic systems, driven by technological advancements and increasing regulatory demands. Multi-die designs introduce additional complexity, with vulnerabilities arising from varied chiplet functions and a fragmented supply chain. Standards organizations play a vital role in addressing these challenges by defining security levels, procedures, and certification tests, ensuring chiplet conformance, and emphasizing the collective responsibility of securing advanced semiconductor systems. Security requirements should encompass chiplets, chiplet interconnects, and the overall system.
- Learn about the latest security issues and solutions for electronic systems.
- Understand vulnerabilities and complexities in multi-die designs.
- Gain insights into industry standards and certification processes.
- Explore robust identification, authentication, and secure communication methods.
Watch Now
Featured Speaker
Dana Neustadter
Senior Director of Product Management, 17³Ô¹Ï
Dana is Senior Director of Product Management for 17³Ô¹Ï' security solutions, where she works on problems ranging from automotive applications through interface IP and on up to quantum computing cyberattacks. She has 25+ years of experience in the security, IP, semiconductor, and EDA industries with an emphasis on product strategy, roadmaps, and marketing for security IP. Dana earned an MSEE from the Technical University Cluj-Napoca (Romania).