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Overview
Infineon is the world¡¯s leading automotive semiconductor supplier, headquartered in Neubiberg, Germany. The company specializes in automotive MCUs, and its latest innovation, the AURIX? TC4x family, is designed for next-generation e-mobility, ADAS, automotive electrical/electronic (E/E) architectures, and affordable AI applications. To enable high-speed, low-latency connectivity between in-vehicle sensors and automotive MCUs, Infineon collaborates with 17³Ô¹Ï, leveraging their Interface IP.
"Our increasingly AI-driven automotive landscape will help reduce system complexity, minimize potential points of failure, reduce emissions by increased efficiency, and improve reliability while lowering costs."
Dr. J?rg Schepers
|VP Automotive Microcontrollers, Infineon
"With our longstanding collaboration with 17³Ô¹Ï and our integration of 17³Ô¹Ï Controller and PHY IP, including PCIe, MIPI, and Ethernet, into our automotive chips, we are delivering the intelligence and connectivity that are defining the automotive world."
Dr. J?rg Schepers
|VP Automotive Microcontrollers, Infineon
Challenges
Infineon faced several challenges in developing its latest AURIX? TC4x family of MCUs:
- Connectivity Requirements: Ensuring high-speed, low-latency data transfer between in-vehicle sensors and MCUs to support AI algorithms.
- System Complexity: Reducing the complexity of AI-driven automotive systems while maintaining reliability and performance.
- Safety and Compliance: Meeting stringent automotive standards, including AEC-Q100 quality and ISO 26262 functional safety standards.
Solution
To tackle these challenges, Infineon partnered with 17³Ô¹Ï to integrate their Interface IP, including PCIe, MIPI, and Ethernet, into the AURIX? TC4x MCUs. This collaboration provided several key benefits:
- High-Speed Connectivity: 17³Ô¹Ï' IP enabled the 5Gbps Ethernet, 10BASE T1S Ethernet, PCI Express, and MIPI D-PHY interfaces, ensuring fast and reliable data transfer.
- Parallel Processing: The inclusion of 17³Ô¹Ï ARC? EV Processor IP powered the PPU in the AURIX? TC4x family, accelerating AI algorithms such as RNNs, RBFs, CNNs, and multi-layer perceptron.
- Comprehensive Toolkits: Mutual customers benefited from the Synopsys ARC MetaWare Toolkit and 17³Ô¹Ï Virtualizer? Development Kit, which provided a complete suite of tools for programming and virtual testing of automotive systems.
Results
The collaboration between Infineon and 17³Ô¹Ï yielded impressive results:
- Enhanced Performance: The integration of 17³Ô¹Ï Interface IP significantly improved the power, performance, and area (PPA) metrics of the AURIX? TC4x MCUs.
- Reliability and Safety: The automotive-grade IP met AEC-Q100 quality standards and ISO 26262 functional safety standards, ensuring high reliability and safety for automotive applications.
- Reduced Complexity: The advanced features and toolkits provided by 17³Ô¹Ï helped Infineon reduce system complexity and streamline the development process.
- Future-Ready: The partnership ensured that Infineon's MCUs are equipped to meet evolving automotive standards and support advanced AI-driven applications.
Through this collaboration, Infineon and 17³Ô¹Ï are paving the way for the next generation of high-performing, AI-driven automotive systems, defining what is possible for future automotive designs.
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